Patterning process in micro-nano processing Laser beam

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Patterning process in micro-nano processing Laser beam

By admin / Date Aug 20,2020

Suzhou Si-Era Electronic Technology Co., Ltd. (Si-Era) is located in the largest MEMS industry cluster in China-Suzhou Nano City. With nearly 20 years of technology accumulation in the MEMS field, he has a lot of design and process experience in MEMS sensors, biological MEMS, optical MEMS, and radio frequency MEMS.

The patterning process of micro-nano processing is mainly divided into two technologies: pattern transfer and direct processing. The pattern transfer technology includes three parts: thin film deposition, pattern imaging, and pattern transfer. The direct processing laser beam etching technology has the ability to write directly, avoiding the multi-step process of pattern transfer, by controlling the focused high-energy laser (shortwave/pulse) beam to directly produce fine structures on the etching material, with micron/sub-micron films The etching processing accuracy is suitable for a variety of materials to realize the production of three-dimensional microstructures.

Micro-nano manufacturing technology refers to the design, processing, assembly, integration and application technology of parts with dimensions of millimeters, micrometers, and nanometers, and components or systems composed of these parts. Traditional "macro" machinery manufacturing technology can no longer meet the high-precision manufacturing and assembly processing requirements of these "micro" machinery and "micro" systems, and it is necessary to research and apply micro-nano manufacturing technologies and methods. Micro-nano manufacturing technology is the basic means and important foundation for the manufacturing of micro-sensors, micro-actuators, micro-structures and functional micro-nano systems.